Analysis of Complete Power-Distribution Network and Co-Design Optimization

概要

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This paper describes the modelling analysis for a power-distribution network and demonstrates co-design and co-simulation in using the detailed prototype model, which includes a chip, package, and printed circuit board. A circuit simulator and a 2D solver using the finite element method are used to study the frequency and transient responses for the core switching noise. In the model, we assume a chip model (current profile and on-chip capacitance) and define the circuit parameters with an equivalent circuit to meet the target impedance. Then the physical design of the package and printed circuit board were done to check all of the required circuit parameters. According to the modelling and evaluation, the package design with a low equivalent series inductance capacitor in the bottom layer and a thin core structure is more advantageous than a capacitor in the top layer.
The Japan Institute of Electronics Packagingの論文