Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards

スポンサーリンク

概要

• 論文の詳細を見る

• A novel Cu surface treatment method was developed to improve the adhesion between smooth Cu surfaces and epoxy dielectric layers using a silane coupling agent. In this process, the Cu surface was first modified with a functional group, which was then treated with the silane coupling agent. Here, we investigated the effect of the functional group and the silane coupling agent on the adhesion strength between Cu and epoxy dielectric layers. We also investigated the influence of the Cu/dielectric adhesion layer on smooth Cu wirings of the printed circuit board manufacturing process compatibility. From this study, it was found that two-step Cu surface modification with triazine trithiol followed by treatment of mercapto-group containing silane coupling agent would dramatically enhance the adhesion strength. It was found that a thin triazine trithiol layer was very effective to improve desmear-resistance.

• The Japan Institute of Electronics Packagingの論文

著者

• Uenishi Keisuke

  Graduate School of Engineering, Osaka University

• Tani Motoaki

  Next-Generation Manufacturing Technologies Research Center, Fujitsu Laboratories Ltd.

• Sasaki Shinya

  Next-Generation Manufacturing Technologies Research Center, Fujitsu Laboratories Ltd.

関連論文

• Effects of a Third Element on Microstructure and Mechanical Properties of Eutectic Sn-Bi Solder
• Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards

スポンサーリンク