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Technical Association of Photopolymers, Japan | 論文
- Defining the Biology-Materials Interface using both 2D and 3D Lithography
- Reduction of the Outgassing Segment in Acetal Based Chemically Amplified Resist for EUV Lithography
- Resist materials design to improve resolution and sensitivity in EUV lithography
- Basic Aspects of Acid Generation Process in Chemically Amplified Electron Beam Resist
- Chemically Amplified Main Chain Scission: New Concept to Reduce Line Edge Roughness and Outgassing
- Study of Binder Resins Used in Presensitized Lithographic Printing Plate
- The influence of deposition condition on mechanical and electrical properties of Sn-doped indium oxide layer on plastic substrate
- Physical Gelation of Nematic Liquid Crystals with Amino Acid Denvatives Leading to the Formation of Soft Solids Responsive to Electric Field
- Defluorination treatment of polytetrafluoroethylene surface by atmospheric pressure glow plasma with boron source
- KPFM observation for photo-assisted formation of donor-acceptor spatial distribution in organic photovoltaic devices
- The Near Ultraviolet and Infrared Light Dye-Sensitized Systems and Application to The Photoimaging
- The Alkali Soluble Critical State of Photodecomposition Product of PAC and Its ACOOH
- A Novel Positive Working Photosensitive Polymer for Semiconductor Surface Coating
- Study on Photopolymerization of Addtion Products of Multifunctional Acrylates and Alkoxysilyl Alkyl Thiol
- Development of Non-Adhesive Type Flexible Copper Clad Laminate"UPISEL-N"
- Issues and requirements of polymers for thermal NIL
- Photolithographic Properties of Photosensitive Sol-gel Materials and Their Application to Optical Waveguides
- Image-formation property based on thermosensitive color-reaction and photo-sensitive polymerization in sub-micrometer microcapsules
- EUV lithography development and research challenges for the 22 nm half-pitch
- A Sensitive Positive Resist for 0.1μm Electron-Beam Direct Writing Lithography