Study on the Distribution Control of Etching Rate and Critical Dimensions in Microwave Electron Cyclotron Resonance Plasmas for the Next Generation 450 mm Wafer Processing (Special Issue : Dry Process)
スポンサーリンク
概要
著者
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Tamura Hitoshi
Research & Development Center Stanley Electric Co. Ltd.
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Maeda Kenji
Central Research Laboratory, Hitachi, Ltd., 1-280 Higashi-Koigakubo, Kokubunji, Tokyo 185-8601, Japan
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Obama Shinji
Kasado Design and Production Division, Hitachi High-Technologies Corporation, Kudamatsu, Yamaguchi 744-0002, Japan
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Miya Go
Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185-8601, Japan
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Izawa Masaru
Kasado Design and Production Division, Hitachi High-Technologies Corporation, Kudamatsu, Yamaguchi 744-0002, Japan
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- Study on the Distribution Control of Etching Rate and Critical Dimensions in Microwave Electron Cyclotron Resonance Plasmas for the Next Generation 450 mm Wafer Processing (Special Issue : Dry Process)
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