Texture of Electroplated Copper Film under Biaxial Stress

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文

著者

• Wang Xin-jian

  School Of Materials Science And Engineering Shanghai Jiao Tong University

• Hong Bo

  School Of Materials Science And Engineering Shanghai Jiao Tong University

関連論文

• Texture of Electroplated Copper Film under Biaxial Stress
• Texture of Electroplated Copper Film under Biaxial Stress
• X-ray Diffraction Analysis of the Recrystallization Behavior of SiC_w/Al Composite at High Temperature
• Variation of the Thermal Stress in the Al_B_4O_/Al Composite during Low Temperature Cycling
• Effects of Ultrasound on Morphology of Copper Electrodeposited on Titanium in Aqueous and Organic Solutions

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