Texture of Electroplated Copper Film under Biaxial Stress
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概要
- 論文の詳細を見る
- 2006-09-20
著者
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Wang Xin-jian
School Of Materials Science And Engineering Shanghai Jiao Tong University
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HONG Bo
School of Materials Science and Engineering, Shanghai Jiao Tong University
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JIANG Chuan-hai
School of Materials Science and Engineering, Shanghai Jiao Tong University
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Hong Bo
School Of Materials Science And Engineering Shanghai Jiao Tong University
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Jiang Chuan-hai
School Of Materials Science And Engineering Shanghai Jiao Tong University
関連論文
- Texture of Electroplated Copper Film under Biaxial Stress
- Texture of Electroplated Copper Film under Biaxial Stress
- X-ray Diffraction Analysis of the Recrystallization Behavior of SiC_w/Al Composite at High Temperature
- Variation of the Thermal Stress in the Al_B_4O_/Al Composite during Low Temperature Cycling
- Effects of Ultrasound on Morphology of Copper Electrodeposited on Titanium in Aqueous and Organic Solutions