Variation of the Thermal Stress in the Al_<18>B_4O_<33w>/Al Composite during Low Temperature Cycling

スポンサーリンク

概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2005-05-20

著者

• JIANG Chuanhai

  School of Materials Science and Engineering, Shanghai Jiao Tong University

• Hong Bo

  School Of Materials Science And Engineering Shanghai Jiao Tong University

• Jiang Chuanhai

  School Of Materials Science And Engineering Shanghai Jiao Tong University

関連論文

• Thermal Relaxation of Residual Stresses in Shot Peened Surface Layer on TiB_2/Al Composite at Elevated Temperatures
• Texture of Electroplated Copper Film under Biaxial Stress
• Texture of Electroplated Copper Film under Biaxial Stress
• Surface Layer Characteristics of TiB_2/Al Composite by Stress Peening
• Residual Stress Relaxation in Shot Peened Surface Layer on TiB_2/Al Composite under Applied Loading
• X-ray Diffraction Analysis of the Recrystallization Behavior of SiC_w/Al Composite at High Temperature
• Variation of the Thermal Stress in the Al_B_4O_/Al Composite during Low Temperature Cycling
• Effects of Ultrasound on Morphology of Copper Electrodeposited on Titanium in Aqueous and Organic Solutions

スポンサーリンク