Proposal of New Polishing Mechanism Based on Feret's Diameter of Contact Area between Polishing Pad and Wafer

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概要

• 論文の詳細を見る

• Relationships between pad surface characteristics and polishing rate are investigated. New parameter ``total Feret's diameter'' of contact portions is proposed as a key parameter, which shows simple correlation to the polishing rate. Feret's diameter is a projection length of a contact shape. Based on Feret's diameter, a new polishing model is proposed in which material is removed by abrasive particles existing at periphery of the pad contact portions, not on them. When a pad contact portion moves on a wafer, abrasive particles gathers at the front end of the contact portion and they remove the wafer surface material by absorbing molecules on their surface. Number of particles at contact portion is considered to be proportional to Feret's diameter.

• 2013-12-25

著者

• Isobe Akira

  Kyushu University, Fukuoka 819-0395, Japan

• Akaji Masatoshi

  Nitta Haas Inc., Kyotanabe, Kyoto 610-0333, Japan

• Kurokawa Shuhei

  Kyushu University, Fukuoka 819-0395, Japan

関連論文

• Mechanisms of Local Planarization Improvement Using Solo Pad in Chemical Mechanical Polishing
• New Model of Defect Formation Caused by Retainer Ring in Chemical Mechanical Polishing
• Proposal of New Polishing Mechanism Based on Feret's Diameter of Contact Area between Polishing Pad and Wafer

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