Isobe Akira | Kyushu University, Fukuoka 819-0395, Japan
スポンサーリンク
概要
関連著者
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Isobe Akira
Kyushu University, Fukuoka 819-0395, Japan
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Komiyama Takashi
Tokyo Seimitsu Co., Ltd., Hachioji, Tokyo 192-0032, Japan
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Kurokawa Syuhei
Kyushu University, Fukuoka 819-0395, Japan
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Yokoyama Toshiyuki
Tokyo Seimitsu Co., Ltd., Hachioji, Tokyo 192-0032, Japan
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Akaji Masatoshi
Nitta Haas Inc., Kyotanabe, Kyoto 610-0333, Japan
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Kurokawa Shuhei
Kyushu University, Fukuoka 819-0395, Japan
著作論文
- Mechanisms of Local Planarization Improvement Using Solo Pad in Chemical Mechanical Polishing
- New Model of Defect Formation Caused by Retainer Ring in Chemical Mechanical Polishing
- Proposal of New Polishing Mechanism Based on Feret's Diameter of Contact Area between Polishing Pad and Wafer