Room-Temperature Bonding Technique Based on Copper Nanowire Surface Fastener
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概要
- 論文の詳細を見る
A free-standing copper nanowire array was directly fabricated on a silicon substrate by improved template-assisted electrodeposition. A room-temperature bonding technique was realized by pressing two nanowire arrays against each other. The van der Waals forces between the interconnected nanowires contributed to the room-temperature bonding which exhibited good mechanical and electrical properties. Theoretical analysis further showed that a much higher mechanical strength can be obtained if most copper nanowires could interconnect with each other.
- 2013-03-25
著者
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Wang Peng
Department Of Clinical Laboratories Peking Union Medical College Hospital Chinese Academy Of Medical
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JU Yang
Department of Mechanical Engineering, Tohoku University
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Chen Mingji
Department Of Mechanical Science And Engineering Graduate School Of Engineering Nagoya University
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Hosoi Atsushi
Department Of Mechanical Science And Engineering Nagoya University
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Song Yuanhui
Department of Mechanical Science and Engineering, Nagoya University, Nagoya 464-8603, Japan
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Wang Peng
Department of Mechanical Science and Engineering, Nagoya University, Nagoya 464-8603, Japan
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Ju Yang
Department of Mechanical Science and Engineering, Nagoya University, Nagoya 464-8603, Japan
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Iwasaki Yuka
Department of Mechanical Science and Engineering, Nagoya University, Nagoya 464-8603, Japan
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Hosoi Atsushi
Department of Mechanical Science and Engineering, Nagoya University, Nagoya 464-8603, Japan
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Song Yuanhui
Department of Mechanical Science and Engineering, Nagoya University
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WANG Peng
Department of Bioengineering, Nanjing University of Science and Technology
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IWASAKI Yuka
Department of Mechanical Science and Engineering, Nagoya University
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