Spatial Fourier Transform Analysis of Polishing Pad Surface Topography
スポンサーリンク
概要
- 論文の詳細を見る
The spatial Fourier transform analysis is proposed to quantitatively evaluate the irregular topography of the conditioned chemical mechanical polishing (CMP) pad surface. We discuss the power spectrum in the spatial wavelengths of the surface topographies corresponding to polishing time. We conclude that the spatial wavelength of less than 5 μm in the topography yielded high material removal rates.
- 2012-05-25
著者
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Suzuki Keisuke
Faculty Of Science Kwansei Gakuin University
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Kushida Takashi
Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
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Kimura Keiichi
Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
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Khajornrungruang Panart
Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
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Okuzono Takahisa
Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
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