Slurry Supplying Method for Large Quartz Glass Substrate Polishing

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概要

• 論文の詳細を見る

• Chemical mechanical polishing (CMP) has been used in polishing a photomask substrate in flat-panel display (FPD) manufacture. Moreover, the quadrilateral geometry of quartz glass used as the photomask substrate has been enlarged. However, the slurry cannot flow throughout the glass surface evenly owing to the enlarged substrate covering the center of the platen in the polishing process. In this work, we verified the beneficial of spreading slurry into a non-inflow region by the reinforced suction of the slurry supplied to the polishing pad through a hole at center of the platen. A fluorescent agent was used instead of the slurry for flow visualization.

• 2011-05-25

著者

• Suzuki Keisuke

  Faculty Of Science Kwansei Gakuin University

• Kimura Keiichi

  Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan

• Yui Ryuji

  Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan

• Khajornrungruang Panart

  Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan

• Wada Nagisa

  Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan

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