Effect of Interfacial Microstructures on the Bonding Strength of Sn--3.0Ag--0.5Cu Pb-Free Solder Bump
スポンサーリンク
概要
- 論文の詳細を見る
The effect of interfacial microstructures on the bonding strength of Sn--3.0Ag--0.5Cu Pb-free solder bumps with respect to the loading speed, annealing time, and surface finish was investigated. The shear strength increased and the ductility decreased with increasing shear speed, primarily because of the time-independent plastic hardening and time-dependent strain-rate sensitivity of the solder alloy. The shear strength and toughness decreased for all surface finishes under the high-speed shear test of 500 mm/s as a result of increasing intermetallic compound (IMC) growth and pad interface weakness associated with increased annealing time. The immersion Sn and organic solderability preservative (OSP) finishes showed lower shear strength compared to the electroless nickel immersion gold (ENIG) finish. With increasing annealing time, the ENIG finish exhibited the pad open fracture mode, whereas the immersion Sn and OSP finishes exhibited the brittle fracture mode. In addition, the shear strength of the solder joints was correlated with each fracture mode.
- 2012-05-25
著者
-
Kim Jae-Myeong
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk 760-749, Korea
-
Park Young-Bae
School of Material Science and Engineering, Andong National University, Andong 760-749, Korea
-
Park Young-Bae
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk 760-749, Korea
-
Jeong Myeong-Hyeok
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk 760-749, Korea
-
Yoo Sehoon
Micro-Joining Center, Korea Institute of Industrial Technology, Incheon 406-840, Korea
関連論文
- Effect of Wet Chemical Pretreatment Conditions on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide Films
- Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion Energy between Inkjet-Printed Ag and Polyimide
- Effect of Interfacial Microstructures on the Bonding Strength of Sn--3.0Ag--0.5Cu Pb-Free Solder Bump
- Interfacial Adhesion Energy of Ru--AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru--AlO Thin Film
- Effects of Temperature and Humidity Treatment Conditions on the Interfacial Adhesion Energy between the Electroless-Plated Ni and Polyimide