Park Young-Bae | School of Material Science and Engineering, Andong National University, Andong 760-749, Korea
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概要
- Park Young-Baeの詳細を見る
- 同名の論文著者
- School of Material Science and Engineering, Andong National University, Andong 760-749, Koreaの論文著者
関連著者
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Park Young-Bae
School of Material Science and Engineering, Andong National University, Andong 760-749, Korea
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Park Sung-Cheol
School of Material Science and Engineering, Andong National University, Andong 760-749, Korea
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Lee Kyu
Deparment Of Obstetrics & Gynecology College Of Medicine Pusan National University
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Min Kyoung-Jin
School of Material Science and Engineering, Andong National University, Andong 760-749, Korea
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Jeong Yongsoo
Department of Surface Technology, Korea Institute of Materials Science, Changwon 641-010, Korea
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Kim Jae-Myeong
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk 760-749, Korea
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Park Young-Bae
School of Materials Science and Engineering, Andong National University, Andong 760-749, Korea
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Park Young-Bae
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk 760-749, Korea
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Jeong Myeong-Hyeok
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk 760-749, Korea
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Yoo Sehoon
Micro-Joining Center, Korea Institute of Industrial Technology, Incheon 406-840, Korea
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Kim Jeong-Kyu
School of Materials Science and Engineering, Andong National University, Andong, Gyeongbuk 760-749, Korea
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Kim Soo-Hyun
School of Materials Science and Engineering, Yeungnam University, Gyeongsan, Gyeongbuk 712-749, Korea
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Cheon Tae-Hoon
School of Materials Science and Engineering, Yeungnam University, Gyeongsan, Gyeongbuk 712-749, Korea
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Park Sung-Cheol
School of Materials Science and Engineering, Andong National University, Andong 760-749, Korea
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Jeong Yongsoo
Department of Surface Technology, Korea Institute of Materials Science, Changwon 641-831, Korea
著作論文
- Effect of Wet Chemical Pretreatment Conditions on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide Films
- Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion Energy between Inkjet-Printed Ag and Polyimide
- Effect of Interfacial Microstructures on the Bonding Strength of Sn--3.0Ag--0.5Cu Pb-Free Solder Bump
- Interfacial Adhesion Energy of Ru--AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru--AlO Thin Film
- Effects of Temperature and Humidity Treatment Conditions on the Interfacial Adhesion Energy between the Electroless-Plated Ni and Polyimide