Tunable Microchip Design for Solvent-Based Bonding of Poly(methyl methacrylate) Substrates by Capillary Force Inequality
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概要
- 論文の詳細を見る
Among various bonding methods for polymeric microfluidic chips, solvent-based bonding techniques present a relatively high bonding strength and a simple bonding process. However, there are still several considerations for bonding success: the bonding time to achieve a high throughput and a low temperature, and the clogging issue from the solvent overflowing into microfluidic channels. In this work, a novel design method and fabrication of microfluidic chips with solvent-based bonding without microchannel clogging are demonstrated. These microfluidic chips could be bonded in just 10 s at room temperature without additional steps or materials. By using the capillary force inequality caused by height differences between the inside and outside of the microchannel, we could control the solvent movement for bonding two chips. In conclusion, the tunable microchips obtained by the proposed solvent bonding technology might make mass production possible.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2011-06-25
著者
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KANG Yeon
School of Mechanical and Aerospace Engineering, Seoul National University
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Kang Yeon
School of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-742, Republic of Korea
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Park Tae
Institute of Advanced Machinery and Design, Seoul National University, Seoul 151-742, Republic of Korea
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Min Junggi
School of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-742, Republic of Korea
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Yun Hoyoung
School of Mechanical and Aerospace Engineering, Seoul National University, Seoul 151-742, Republic of Korea
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Han Dong-Chul
Institute of Advanced Machinery and Design, Seoul National University, Seoul 151-742, Republic of Korea
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