Novel Fabrication Method of a Round Microtip Based on Aluminum Spike Phenomenon
スポンサーリンク
概要
- 論文の詳細を見る
In this paper, we present a new method of fabricating microtips based on the aluminum spike phenomenon. Silicon dissolves in aluminum at high temperatures above 400 °C, and normally this is an undesirable effect in integrated circuit (IC) processing. However, in this study, this phenomenon is exploited, with which a round tip is fabricated by a simple process involving the annealing of aluminum at 800 °C; a major advantage of the method is that the apex of the fabricated tip is round. The penetration depth of aluminum increases with annealing time, and the height of the fabricated tip can be controlled by adjusting annealing time. The height and width of the tip, annealed for 25 min using (100) silicon wafer, are 40 and 80 μm, respectively.
- 2011-01-25
著者
-
Yang Sang
Department of Electrical and Computer Engineering, Ajou University, Suwon 443-749, Korea
-
Kim Geunyoung
Department of Electrical and Computer Engineering, Ajou University, Suwon 443-749, Korea
-
Park Tae-Gyu
Korea Bio-IT Foundry Seoul Center, Institute of Advanced Machinery and Design, Seoul National University, Seoul 151-742, Korea
-
Park Tae-Gyu
Korea Bio-IT Foundry Center, IAMD, Seoul National University, Seoul 151-742, Republic of Korea
-
Kim Kangil
Department of Electrical and Computer Engineering, Ajou University, Suwon 443-749, Korea
関連論文
- Novel Fabrication Method of a Round Microtip Based on Aluminum Spike Phenomenon
- A Glucose Sensor Based on an Organic Electrochemical Transistor Structure Using a Vapor Polymerized Poly(3,4-ethylenedioxythiophene) Layer
- Field emission ion source using a carbon nanotube array for micro time-of-flight mass spectrometer (Special issue: Microprocesses and nanotechnology)
- Simple Atmospheric-Pressure Nonthermal Plasma-Jet System for Poly(dimethylsiloxane) Bonding Process
- A Micromachined Flexible Hollow Cathode Discharge Device