Copper Multilayer Interconnection Using Ultravaiolet Nanoimprint Lithography with a Double-Deck Mold and Electroplating
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概要
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An approach to realizing a two-step interconnection using a double-deck quartz mold based on ultraviolet nanoimprint lithography (UV-NIL) technology and Cu electroplating is discussed. The double-deck mold realizes a two-step simultaneous transcription and a two-step nanoscale interconnection. Nanoscale via and trench array patterns of Cu were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted via and trench patterns were simultaneously formed on a photocurable resin by the double-deck mold with a two-step structure. Using this mold, 73 nm metal via and 190 nm metal trench patterns were successfully fabricated by electroplating.
- 2009-11-25
著者
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Sakuma Katsuyuki
Major in Nano-Science and Nano-Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan
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Shoji Shuichi
Major in Nano-Science and Nano-Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan
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Shoji Shuichi
Major in Nano-science and Nano-engineering, School of Science and Technology, Waseda University, Tokyo 169-8555, Japan
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Ono Hiroshi
Major in Nano-science and Nano-engineering, School of Science and Technology, Waseda University, Tokyo 169-8555, Japan
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Mizuno Jun
Major in Nano-Science and Nano-Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan
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Nagai Noriyasu
Major in Nano-Science and Nano-Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan
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Saito Mikiko
Major in Nano-Science and Nano-Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan
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