Fabrication of a Microchannel Device by Hot Embossing and Direct Bonding of Poly(methyl methacrylate)
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概要
- 論文の詳細を見る
We have fabricated a 50-μm-wide and a 30-μm-deep microchannel device by hot embossing and the direct bonding of poly(methyl methacrylate) (PMMA) plates with dimensions of $20\times 20\times 1$ mm3 and evaluated the device’s mechanical, optical, and fluidic characteristics. The device’s bond strength was confirmed to be sufficiently high for practical use as well as for withstanding severe cleaning conditions, such as ultrasonic cleaning in deionized water. The optical loss around the bonded interface was also evaluated, and no increase in light absorption was observed. There was no leakage or obstacles to smooth fluidic flow when methylene blue test liquid flowed in the channel. The above results confirmed that the hot embossing and direct bonding technologies for microchannel manufacturing using PMMA plates can realize high-performance microchannel devices.
- 2007-06-15
著者
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Shinohara Hidetoshi
Major In Nano-science And Nano-engineering Waseda University
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Shoji Shuichi
Major in Nano-science and Nano-engineering, School of Science and Technology, Waseda University, Tokyo 169-8555, Japan
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Mizuno Jun
Major in Nano-Science and Nano-Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan
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Mizuno Jun
Major in Nano-Science and Nano-Engineering, Waseda University, Tokyo 169-8555, Japan
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Shinohara Hidetoshi
Major in Nano-Science and Nano-Engineering, Waseda University, Tokyo 169-8555, Japan
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