Modification of the Mechanical Properties of SiO2 Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

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概要

• 論文の詳細を見る

• In this study, we developed a novel method of modifying thin-film mechanical properties by plasma surface modification. In order to demonstrate the feasibility of this approach, various plasma treatments, including exposure to O2, H2, and NH3 atmospheres, were implemented to modify the mechanical properties, including Young's modulus, residual stress, and hardness, of SiO2 films. The experimental results show that the mechanical properties have been changed following the formation of Si–N and Si–H bonds. These characteristics can be employed to change the shape and resonant frequencies of micromachined beams for micro-electro-mechanical systems (MEMS) applications. Since plasma treatment is simple and easy to integrate with existing processes, it has the potential to be an efficient way to finely modify the mechanical characteristics of MEMS structures.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2008-06-25

著者

• Su Wang-Shen

  National Nano Device Laboratory, Hsinchu 30013, Taiwan

• Fang Weileun

  Department of Power Mechanical Engineering, National Tsing Hua Uninersity, Hsinchu, Taiwan 300, R.O.C.

• Fang Weileun

  Department of Power Mechanical Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan

• Huang Hsin-Yu

  Department of Power Mechanical Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan

関連論文

• Improvement of Specimen Preparation Process for Bulge Test Using the Combination of XeF2 and Deep Reactive Ion Etching
• Modification of the Mechanical Properties of SiO2 Thin Film Using Plasma Treatments for Micro-Electro-Mechanical Systems Applications

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