Observation on the Interdiffusion in Multilayer Ceramic Capacitors
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概要
- 論文の詳細を見る
The interface between dielectric layers (BaTiO3) and internal electrode layers (Ni) in X7R type multilayer ceramic capacitors (MLCCs) with an active layer thickness of 5 μm was studied by scanning electron microscopy (SEM), high resolution transmission electron microscopy (HRTEM), selected-area electron diffraction (SAED) and energy-dispersive spectroscopy (EDS). Weak interdiffusion was observed between dielectric layers and internal electrode layers. It was found that it was easier for Ni to diffuse into the BaTiO3 perovskite lattice than for BaTiO3 to diffuse into the Ni lattice while neither of the two diffusions extended for a long distance, which was approximately 8 nm on the BaTiO3 side and 3 nm on the Ni side. The mechanism of Ni diffusion was also discussed in this study.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2006-03-15
著者
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Wang Xiaohui
State Key Laboratory Of New Ceramics And Fine Processing Department Of Materials Science And Enginee
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Li Longtu
State Key Laboratory Of New Ceramics And Fine Processing Department Of Materials Science And Enginee
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Wen Hai
State Key Laboratory of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
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Wen Hai
State Key Lab of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
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Li Longtu
State Key Laboratory of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
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Li Longtu
State Key Lab of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
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Wang Xiaohui
State Key Laboratory of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
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Wang Xiaohui
State Key Lab of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China
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