Gravity Field Effect on Copper-Electroless Plating —Comparison with the Magnetic Field Effect
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概要
- 論文の詳細を見る
To compare the gravity field effect on copper-electroless plating with the magnetic field effect on the same reaction, the plating rates were measured under various vertical gravity fields. Consequently, considerably different results from those of the magnetic-field case, where the reaction was suppressed by the magnetic field, were obtained; the reaction was not suppressed but promoted by the gravity field. The total reaction rate increased with increasing gravitational acceleration, and followed the diffusion current equation in a vertical gravity field. The scanning electron microscope (SEM) observation also revealed the promotion by the gravity field, i.e., the increase of crystal sizes with increasing gravitational acceleration. This is because, in the magnetic field, the micro-magnetohydrodynamic (micro-MHD) flows interact with the nonequilibrium fluctuations accompanying the reaction. Therefore, it was concluded that the gravity convection cells occurring under gravity fields do not interact at least up to 170 G with the nonequilibrium fluctuations. At the same time, the density coefficients intrinsic to cathodic and anodic partial reactions were obtained by measuring current responses to sweeping gravitational acceleration, i.e., sweep gravitammetry. By comparing observed data with those calculated from the density coefficients, it was clarified that the autocatalytic process between the cathodic and anodic reactions is more accelerated by gravity convection than the intrinsic autocatalytic process without gravity convection.
- 2004-06-15
著者
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Aogaki Ryoichi
Department Of Industrial Design Polytechnic University
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Oshikiri Yoshinobu
Department Of Environmental Engineering Yamagata College Of Industry & Technology
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Yamada Akifumi
Department Of Chemistry Faculty Of Engineering Nagaoka University Of Technology
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SATO Makoto
Aizu Polytechnic Center
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Aogaki Ryoichi
Department of Product Design, Polytechnic University, 4-1-1 Hashimoto-dai, Sagamihara 229-1196, Japan
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Oshikiri Yoshinobu
Department of Environmental Engineering, Yamagata College of Industry & Technology, 2-2-1 Matsuei, Yamagata-shi, Yamagata 990-2487, Japan
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AOGAKI Ryoichi
Department of Electronic System Engineering, Polytechnic University
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