Design and Demonstration of High Breakdown Voltage GaN High Electron Mobility Transistor (HEMT) Using Field Plate Structure for Power Electronics Applications
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概要
- 論文の詳細を見る
AlGaN/GaN power high electron mobility transistors (HEMTs) with a breakdown voltage of 600 V are fabricated and demonstrated as switching power devices for motor drive and power supply applications. A high breakdown voltage was realized in the fabricated power-HEMT by the field plate technique and an ultra low on-state resistance of 3.3 m$\Omega$$\cdot$cm2, which is 20 times lower than the silicon limit, due to the high critical field of the GaN material and the high mobility in a two-dimensional electron gas channel. A device with the double-field plate structure was also designed using two-dimensional device simulation to increase the breakdown voltage without any increase of the GaN layer thickness.
- 2004-04-15
著者
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Tsuda Kunio
Toshiba Research and Development Center
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Omura Ichiro
Toshiba Corporation
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Kuraguchi Masahiko
Toshiba Corporation, R&D Center, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8583, Japan
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Saito Wataru
Toshiba Corporation, Semiconductor Company, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8583, Japan
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Takada Yoshiharu
Toshiba Corporation, R&D Center, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8583, Japan
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Ogura Tsuneo
Toshiba Corporation, Semiconductor Company, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8583, Japan
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Takada Yoshiharu
Toshiba Corporation, R&D Center, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8583, Japan
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Tsuda Kunio
Toshiba Corporation, R&D Center, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8583, Japan
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Omura Ichiro
Toshiba Corporation, Semiconductor Company, 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki 212-8583, Japan
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