Optical Proximity Correction Feature Extraction Method Using Reticle Scanning Electron Microscope Images
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概要
- 論文の詳細を見る
Optical proximity correction (OPC) features are frequently used in photolithography. It is necessary to measure the shape characteristics such as height, width, area, position of center of gravity, and corner-rounding with nm-order accuracy. For this purpose, critical-dimension scanning electron microscope (CD-SEM) images are utilized. However, it is difficult to extract the shape characteristics mentioned above from a corrected pattern with conventional CD-SEM measurement. The authors developed a method to extract the shape characteristics automatically from a corrected reticle pattern with high accuracy, with combination of discriminant analysis and nonlinear regression.
- 2003-06-15
著者
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Kotani Toshiya
Process & Manufacturing Engineering Center Toshiba Corporation Semiconductor Company
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MIYANO Yumiko
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company
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SHIBATA Toru
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company
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IKENAGA Osamu
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company
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Ikeda Takahiro
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Kotani Toshiya
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Shibata Toru
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Ikenaga Osamu
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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