Skewness and Kurtosis Risks of Quality Control in Overlay Inspection
スポンサーリンク
概要
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The population of overlay errors in layer-to-layer structures in semiconductor manufacturing often obeys non-normal distribution functions such as elliptic, rectangular, and skewed distributions. Thus, there can be many wrong diagnoses of quality control that can lead to consumer’s risk and producer’s risk. In a lot acceptance test, a product should be judged by variables rather than by attributes because of the small sample size. A new acceptance test by variables was introduced for a non-normal population. It included sample skewness and kurtosis as well as mean and standard deviations. Using operating characteristic (OC) curves, it was shown that sampling inspection by variables can be applied safely to a strong non-normal population with new variables.
- 2010-06-25
著者
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Ikeda Takahiro
Process & Manufacturing Engineering Center, TOSHIBA CORPORATION Semiconductor Company, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
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Takahiro Ikeda
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation, 8 Shinsugitacho, Isogo-ku, Yokohama 235-8522, Japan
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Sato Takashi
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation, 8 Shinsugitacho, Isogo-ku, Yokohama 235-8522, Japan
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Kasa Kentaro
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation, 8 Shinsugitacho, Isogo-ku, Yokohama 235-8522, Japan
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Masafumi Asano
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation, 8 Shinsugitacho, Isogo-ku, Yokohama 235-8522, Japan
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Yasuharu Sato
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation, 8 Shinsugitacho, Isogo-ku, Yokohama 235-8522, Japan
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Kentaro Kasa
Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation, 8 Shinsugitacho, Isogo-ku, Yokohama 235-8522, Japan
関連論文
- Accuracy of Overlay Metrology with Nonp-enetrating and Negative-Charging Electron Beam of the Scanning Electron Microscope
- Skewness and Kurtosis Risks of Quality Control in Overlay Inspection
- Optical Proximity Correction Feature Extraction Method Using Reticle Scanning Electron Microscope Images