Dehydration after Plasma Oxidation of Porous Low-Dielectric-Constant Spin-on-Glass Films
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概要
- 論文の詳細を見る
In this paper, the dehydration behavior of hydrogen-methyl-siloxane-based porous spin-on-glass (SOG) films after oxygen plasma exposure is reported. The resultant loss of hydrophobic groups from the plasma exposure makes the films hygroscopic and thus the film dielectric constant can significantly increase. We employed a simple method consisting of spin-on coating of hexadimethyldisilazane (HMDS) with successive hotplate baking so as to dehydrate the films and decrease the film dielectric constant.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 2000-07-15
著者
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Kondoh Eiichi
Kyushu Institute Of Technology Center For Microelectronic Systems
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ARAO Hiroki
Catalysts and Chemicals Industry Co.Ltd., Fine Chemicals Research Center
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Asano Tanemasa
Kyushu Inst. Of Technol. Fukuoka Jpn
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Komatsu Michio
Catalysts & Chemicals Industry Co. Ltd.
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Nakashima Akira
Catalysts And Chemicals Industry Co.ltd. Fine Chemicals Research Center
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Kondoh Eiichi
Kyushu Institute of Technology, Center for Microelectronic Systems, Kawazu, Iizuka, Fukuoka 820-8502, Japan
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Asano Tanemasa
Kyushu Institute of Technology, Center for Microelectronic Systems, Kawazu, Iizuka, Fukuoka 820-8502, Japan
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Komatsu Michio
Catalysts and Chemicals Industry Co. Ltd., Fine Chemicals Research Center, 13-2 Kitaminato, Wakamatsu, Kitakyushu 808-0027, Japan
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