Enhancement of Copper Surface Oxidation in an Air Atmosphere Due to Fluorine Residue

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概要

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• The changes of a copper surface due to air exposure after fluorocarbon plasma irradiation were investigated by using a plasma beam irradiation apparatus with quasi-in situ X-ray photoelectron spectroscopy. We found that residual fluorine provided by a fluorocarbon plasma etching process on the surface enhanced the speed of copper oxidation by a factor of 10 in a clean room air atmosphere. We, furthermore, found that the fluorinated copper surface could be cleaned by neutral species extracted from H2O plasma without any further oxidation.

• Japan Society of Applied Physicsの論文
• 2004-10-01

著者

• Kurihara Kazuaki

  Environmental Benign Etching Technology Laboratory, ASET, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan

関連論文

• Effects of Air Exposure on SiO2 Surfaces Irradiated with Fluorocarbon Plasma
• Enhancement of Copper Surface Oxidation in an Air Atmosphere Due to Fluorine Residue

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