Directed Self Assembly Materials for Hole Patterning
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概要
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Blend type DSA (Directed self assembly) was applied for hole patterning. The advantage of blend DSA is milder anneal condition than PS-b-PMMA BCP DSA materials, and further good point of blend DSA is studied. A blend DSA material was applied to shrink 56nmH110nmP to give 33nmH110nmP. Local CDU and wafer CDU were also improved after hole pattern shrink. Blend DSA is able to keep CDY/CDX elongated hole pattern of change. The kept shape shrink was also observed at the L-plate trench shrink. Sub-20nm hole formation was also tried with blend type DSA. From 40nmH80nmP guide-pattern, 18nmH80nmP was generated.
- The Society of Photopolymer Science and Technology (SPST)の論文
The Society of Photopolymer Science and Technology (SPST) | 論文
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