Surface Relief and Porous Structure Patterning of Polyimide
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概要
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Polyimides have excellent properties such as thermo stability, mechanical strength, and chemical stability, which are widely used as the materials for microelectronics and aerospace. We discover the new process of porous structure patterning and surface relief patterning. Porous structure patterning of polyimide is based on poly (amide acid) and photo acid generator (PAG, NAI100). Photo irradiation of the PAA in the presence of PAG induce surface relief grating after thermal imidization. The tone can be controlled using PAG or PBG. The mechanism of the pattern formation is based on the change in imidization temperature by the PAG or PBG.
- The Society of Photopolymer Science and Technology (SPST)の論文
The Society of Photopolymer Science and Technology (SPST) | 論文
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