Underlayer Designs to Enhance EUV Resist Performance
スポンサーリンク
概要
- 論文の詳細を見る
Extreme ultraviolet (EUV) lithography has gained momentum as the method of choice for <32-nm half-pitch device fabrication. In this paper, we describe our initial efforts to increase the EUV resist's performance via introduction of a thermally crosslinkable underlayer. We have demonstrated the benefits of adding an EUV underlayer into the regular EUV litho stack and investigated the effect of underlayer film thickness, post-coat bake temperature, and adding other additives such as PAG and sensitizer on the overall litho performance of EUV resists.
- The Society of Photopolymer Science and Technology (SPST)の論文
The Society of Photopolymer Science and Technology (SPST) | 論文
- Influence of Solvent Vapor Atmospheres to the Self-assembly of Poly(styrene-b-dimethylsiloxane)
- Conventional Measurement Method of Film Resistance of Plasma-Polymerized Thin Films Using a High-Resistance Meter
- Synthesis and Optical Properties of Carbazole-Containing Donor-Acceptor Type Conjugated Polymers
- Novolak Resist Removal Using Laser (266/532nm)
- Evaluation of Fluorinated Diamond Like Carbon as Antisticking Layer by Scanning Probe Microscopy