Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

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概要

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• There are two major methods, experimental and numerical approaches, for dealing with the strain and stress analysis essential to reliability assessment of electronic packaging. Both approaches are mutually complementary in view point of their assessment capability. In this paper, experimental and numerical simulation results for analyzing some reliability issues of electronic packages were reviewed, and the role of both approaches were discussed.

• 一般社団法人 日本機械学会の論文

著者

• Lee Soon-bok

  Department Of Mechanical Engineering Korea Advanced Institute Of Science And Technology

• JANG Jae-Won

  Department of Mechanical Engineering, KAIST

• LEE Soon-Bok

  Department of Mechanical Engineering, KAIST

関連論文

• Reliability Assessment of Advanced Materials and Structures
• Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging
• Korea Advanced Institute of Science and Technology (KAIST) Computer Aided Reliability Evaluation Laboratory (CARE Lab.)
• Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

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