Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging

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概要

• 論文の詳細を見る

• Reliability of the solder bump has been studied by accelerated testing with several experimental techniques. A new thermal fatigue test apparatus using thermal conduction was constructed, which could produce temperature gradient effects without any additional design of test specimen and control the temperature of specimen easily. For the simulation of temperature change due to the heat generation of chip, a specimen (chip) was put on a heating plate through which heat flux was conducted. A smallsized electromagnetic type fatigue tester and a micro-mechanical testing machine were developed. High cycle fatigue test was performed by a small-sized electromagnetic type fatigue-tester. The time to failure was determined by measuring the changes in resistance. Using micro-mechanical tester, isothermal fatigue test was performed to investigate the optimum shape of solder bumps. The isothermal low cycle fatigue test of solder bumps was performed with four different shapes and the equivalent plastic strain distributions of four different cases were calculated using finite element method.

• 一般社団法人日本機械学会の論文
• 2000-10-15

著者

• Lee Soon-bok

  Department Of Mechanical Engineering Korea Advanced Institute Of Science And Technology

• Park Tae-sang

  Department Of Mechanical Engineering Korea Advanced Institute Of Science And Technology

• Ham Suk-jin

  Department Of Mechanical Engineering Korea Advanced Institute Of Science And Technology

関連論文

• Reliability Assessment of Advanced Materials and Structures
• Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging
• Korea Advanced Institute of Science and Technology (KAIST) Computer Aided Reliability Evaluation Laboratory (CARE Lab.)
• Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging

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