Korea Advanced Institute of Science and Technology (KAIST) Computer Aided Reliability Evaluation Laboratory (CARE Lab.)
スポンサーリンク
概要
- 論文の詳細を見る
- 2006-12-25
著者
-
Lee Soon-bok
Department Of Mechanical Engineering Korea Advanced Institute Of Science And Technology
-
Lee Soon-bok
Department Of Mechanical Engineering Korea Advanced Institute Of Science And Technology(kaist)
関連論文
- Reliability Assessment of Advanced Materials and Structures
- Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging
- Korea Advanced Institute of Science and Technology (KAIST) Computer Aided Reliability Evaluation Laboratory (CARE Lab.)
- Experimental and Numerical Approaches for Reliability Evaluation of Electronic Packaging