Surface Modification of Insulation Resin for Build-up Process Using TiO2 as a Photocatalyst and Its Application to the Metallization

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概要

• 論文の詳細を見る

• Fabrication of fine circuits on the printed circuit board (PCB) is one of the key process to realize the downsizing of electronic devices. Fine line circuits were created without roughening the surface of PCB and no extraneous deposition was observed between lines by introducing a surface modification by photocatalyst. Modified layer in depth of 20∼30 nm was produced on the PCB surface by the irradiation of UV light under the presence of TiO2 as a photocatalyst. Adhesion was derived from the nano-level anchor effect by the formation of co-existed layer between modified PCB surface and deposited copper. This new surface modification method has an intrinsic advantage for the formation of fine patterned PCBs.

• 公益社団法人 電気化学会の論文

著者

• Honma Hideo

  Graduate School Of Engineering Kanto Gakuin University

• BESSHO Takeshi

  Toyota Motor Corporation

• Inoue Kotoku

  Graduate School Of Engineering Kanto Gakuin University

• HONMA Hideo

  Graduate School of Engineering, Kanto Gakuin University

• KOIWA Ichiro

  Graduate School of Engineering, Kanto Gakuin University

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• Surface Modification of Insulation Resin for Build-up Process Using TiO2 as a Photocatalyst and Its Application to the Metallization

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