Direct Formation of Patterned Nickel Film on Polymer Using Selective Electroless Deposition and Electroless Anisotropic Growth Plating

概要

論文の詳細を見る
Plating on plastic technology is widely applied in electronics-related fields. Conventionally, good adhesion strength between metal and resin has been obtained from the anchoring effect of a roughened surface. However, as the frequency increases, detrimental influences arise from the skin effect in the high-speed transmission. Therefore, the interface of the conductor and substrate should be as smooth as possible. A metal film with high adhesion strength and surface smoothness can be formed by surface modification with UV irradiation. This led us to the examination of selective deposition with the UV irradiation technique. In addition, anisotropic growth has been obtained by the addition of inhibitors to the electroless plating bath where pattern formation was possible without using resist by controlling the horizontal growth during plating. Anisotropic growth on selectively UV-irradiated regions has been obtained by the addition of inhibitors to the electroless nickel-plating solution and in this study, direct nickel-pattern formation was accomplished without using resist by controlling the plating growth in the horizontal direction in a technique combining selective deposition and anisotropic growth.