Ni-WC分散めっきの粒子-マトリックス反応

概要

論文の詳細を見る
This study has been conducted to elucidate the thermal interfacial reaction between dispersed 1μm WC particles and the Watts Ni matrix. The reaction was characterized by chemical analysis and ductility testing of the composite after 1h annealing at temperatures up to 1000°C, as well as by transmission electron microscopy of the extracted particles. A particle-matrix bonding reaction occurred at temperatures above 300°C, and the bonding strengthened increasingly at higher temperatures. The reaction was found to be comprised by the dissolution of tungsten at the particle surface into the matrix, and the formation of a graphite carbon film, which enveloped the WC particles. Thus the bond strength comes from the WC/Graphite/Ni interface. Once the graphite film had grown to a thickness of only about 70Å at the expense of the approximately 160Å-thick WC surface layer, it functioned as a reaction barrier inhibiting further progress in tungsten dissolution and thereby in the size decrease of the WC particles.
社団法人表面技術協会の論文