無電解めっきによるスズ-鉛合金皮膜の形成

概要

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Autocatalytic electroless plating of tin-lead alloy film has been achieved for the first time using titanium trichloride as a reducing agent.It was possible to form bright, highly dense films with excellent solderability directly on alumina and nickel, the former with activation by palladium and the latter without.Deposition proceeded under moderate conditions of pH 7.0 and 40-70°C, employing sodium carbonate as a pH controller. Basic bath composition was [stannous chloride+lead chloride] 0.08M, disodium EDTA 0.09M, trisodium citrate 0.24M, NTA 0.10M, titanium trichloride 0.04M, and sodium carbonate for pH adjustment.The lead content of the films was arbitrarily controlled in the range of 3.0-28.0at.% by varying the lead chloride concentration between 0.001 and 0.01M. It was also observed that bath renewal and the addition of titanium trichloride to baths were effective in forming thick tin-lead alloy films.
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