イオンプレーティング法で作製したBN膜の大気中での変質

概要

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Hard BN films with cubic BN (c-BN) phase and soft BN films without c-BN phase were deposited on Si wafer by a reactive ion plating process with a hot cathode plasma discharged within parallel magnetic field. These BN films were left in air with relative humidity of about 30%, 65-85% and 100% for about 3000 hours. The atmospheric degeneration of these BN films was investigated by SEM observation and EPMA measurements. Small particles such as boron oxide, boric acid or ammonium borate were formed at the surface of soft BN films left in air. All BN films were cracked after leaving in air. The cracking became faster with an increase in the relative humidity of air. The cracking of soft BN films occurred more rapidly than that of hard BN films. The cracking of hard BN films was retarded by post annealing.
社団法人粉体粉末冶金協会の論文