新接合法-CHIP接合法-について

概要

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New developed bonding process-CHIP system-which uses the amorphous thin sheet as an insert consumable, melted and diffused by the heating with induction coil was introduced.At first, the equipments and the principal of bonding-TLP (Transient Liquid Phase bonding) process-were described in briefly. And the bonding parameters (bonding temperature, holding time, compressive stress, roughness of an interface) which affected the tensile strength of the bonded joint were explained in detail.Furthemore as practical examples, the properties of bonded joints of the stainless steel pipes (SUS 304), the stainless steel pipe (SUS 304) and the structural carbon steel pipe (STKM 13A), and carbon steel pipe for machine structural use (S 45C) and spheroidal graphite iron casted pipe (FCD 70) showed good results in the tension and flattening tests.
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