Fabrication of Thick Silicon Nitride by Reaction Bonding and Post-Sintering

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概要

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• Reaction-bonded silicon nitride has a potential to lower in cost, since it can be fabricated from low-cost silicon powder. However, because nitridation of silicon is an exothermal reaction, difficulty has been encountered in fabricating thick sintered bodies that exceed 20 mm. In this work, low-cost, thick silicon nitride was fabricated by reaction bonding and post-sintering, and its characteristics and problems were investigated. The obtained silicon nitride showed strength of approximately 500 MPa and fracture toughness of 4.2 MPa m1/2. In fabricating a thick body, powder preparation seems to be an important factor in attaining stable mechanical properties.

• 社団法人　日本セラミックス協会の論文

著者

• Kondo Naoki

  Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Tec

• HYUGA Hideki

  Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Tec

• Kita Hideki

  Advanced Manufacturing Res. Inst. National Inst. Of Advanced Industrial Sci. And Technol. (aist)

• HYUGA Hideki

  Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology (AIST)

• KABA Takahiro

  Kubota Co., Ltd.

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• Fabrication of Thick Silicon Nitride by Reaction Bonding and Post-Sintering

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