C23 Study on Micro Cutting of LiNbO_3 Wafer for Fabrication of SAW Device(Ultra-precision machining)

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概要

• 論文の詳細を見る

• This paper describes with the cutting properties of LiNbO_3 wafer in the direct cutting of micro flow channel for the fabrication of micro pump device driven by surface acoustic wave (SAW) in μ-TAS. The surface integrity of the micro channel finished by micro end milling and the ultra-precision diamond cutting is evaluated under the variety of the cutting conditions and the crystal orientation of work material. The surface integrity extremely depends on the crystal orientation. The surface roughness in micro end milling is ranged from 3μm to 5μm Rz and is improved to approximately 1/10 in the diamond cutting.

• 一般社団法人日本機械学会の論文
• 2009-12-01

著者

• OKUDA Koichi

  Graduate School of Engineering, University of Hyogo

• Okuda Koichi

  Graduate School Of Engineering University Of Hyogo

• TSUNEYOSHI Tatsunori

  Horiguchi Iron Factory Co.

• LI Wei

  Graduate School of Engineering, University of Hyogo

• SHIBAHARA Hideki

  Graduate School of Engineering, University of Hyogo

• SHIZUKA Hiroo

  Graduate School of Engineering, University of Hyogo

• NONOBIKI Masayuki

  Graduate School of Engineering, University of Hyogo

• Shizuka Hiroo

  Graduate School Of Engineering University Of Hyogo

• Shibahara Hideki

  Graduate School Of Engineering University Of Hyogo

• Nonobiki Masayuki

  Graduate School Of Engineering University Of Hyogo

• Li Wei

  Graduate School Of Engineering University Of Hyogo

関連論文

• Surface Integrity of Thick Photo Resist Finished by Ultra-Precision Diamond Cutting(Ultra-precision machining)
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• C23 Study on Micro Cutting of LiNbO_3 Wafer for Fabrication of SAW Device(Ultra-precision machining)
• Study of Influence of Laser Cutting Conditions upon Thermal Deformation of a Base Plate(Laser processing)
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