S0304-1-3 反射型・透過型回折X線を併用したコーティング薄膜の応力測定(回折法による材料評価)

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This paper presents a new measurement method of residual stress in crystal oriented polycrystalline thin-film using transmitted diffraction X-rays. Cover glass with thickness of 0.13mm was used as a substrate, and aluminum thin-film with thickness of 1.1μm was deposited onto its surface using Physical Vapor Deposition technique. Diffraction profile of aluminum thin-film strongly indicated the <111> orientation, diffraction peak, therefore, only appeared at Al(111) and Al(222) planes. To measure the stress in the aluminum thin-film, the two-tilt method combining a reflected diffraction with a transmitted diffraction was used. As a result, it could be clarified that the residual stress in aluminum thin-film deposited on cover glass has about 87 MPa of tensile stress.
社団法人日本機械学会の論文
2009-09-12