1807 旋回流を用いた非接触搬送系に関する研究 : ボルテックスチャック内の流速測定(S24-2 流量計測の新たな展開(2),21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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In semiconductor manufacturing processes, a new pneumatic non-contact handling device is developed. This device named Vortex Chuck makes use of a vacuum at a central area of swirling flow in order to hold the wafer against the device and to prevent significant wafer damage and foreign material contamination. Vortex Chuck provides lower-cost, higher-performance than other pneumatic type devices. Experiments on Vortex Chuck have turned out that the vacuum depends on the gap and supply pressure, but fluid motion inside a chuck is unclear. In order to improve performance of Vortex Chuck, we focused on the fluid motion in a chuck. In this report, a velocity distribution in Vortex Chuck is clarified with PTV, and a pressure distribution is also calculated. Furthermore, the relationship between gap width and fluid motion is discussed.
2008-08-02