TS-109 Creep Deformation and Lifetime Prediction in Advanced Silicon Nitride Ceramics(Session D-7 Materials)

概要

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Tensile creep behavior is examined in three advanced silicon nitride ceramics in the temperature range of 1250 to 1400℃ to reveal the lifetime controlling process and to confirm 10,000h creep resistance. From the creep rupture behavior under high stress level within short testing period less than 1,000h, the relationships between log-log plot of applied stress and time-to-failure exhibits a single straight line in each material examined. Then, the applied stress corresponding to time-to-failure of 10,000h is estimated from the straight lines, and 10,000h creep resistance was successfully confirmed under the predicted applied stress in the most materials. However, at 1300℃ in SN88M, the relationship is divided into two straight lines at the stress of 250MPa. Estimation of deformation parameters reveals that the slop of the log-log plot is nearly equal to the inverse of the stress exponent at the deformation condition. This result indicates that the deformation mechanism should be considered in lifetime prediction.
社団法人日本ガスタービン学会の論文
1999-11-14