117 半導体微細はんだ接合部の疲労き裂発生と進展寿命評価(疲労)

概要

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The fatigue crack growth life and the crack path of micro fillet-shaped solder joints were evaluated by using functions of the fatigue J-integral ΔJ_f and the creep J- integral ΔJ_c , and by applying the criterion Δσ_<θ, max> on ΔJ_I and ΔJ_II. A new auto-mesh generator, which attaches the fine mesh around a crack tip to the original mesh without a crack, was developed for effectively preparing a new mesh pattern of an extended crack. There were much difference in the predicted crack path by criteria of a strain energy density, maximum tangential stress range and equivalent plastic strain range. However the crack path could be successfully predicted by Δσ_<θ, max>. The calculated crack extension life of the solder joints showed considerable difference, because of the comparable effects in the cyclic and time dependency of crack growth.
2006-11-25