4333 3層積層体の反りに対する熱粘弾性解析(J05-4 基板信頼性,J05 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

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Recently, an advanced chip size packaging technology is important for developing portable electronic devices. Chip size package (CSP) is composed of metal, IC, and the polymeric material. Thermal fatigue occurs often due to the difference of thermal properties between a substrate and a chip. Thermal and mechanical loads cause the warpage of CSP. In this study, a simple theory on the bases of a multi-layer plate theory considering a viscoelastic property in substrate and resin sheet is presented. The thermo-viscoelastic analysis for the deflection of CSP is performed. The amount of warpage is predicted when temperature cooled down from 453K of the bonding temperature to 298K in the room temperature. Finally, the results of this study are compared with experimental results.
一般社団法人日本機械学会の論文
2006-09-15