Effects of Macroscopic Pattern Density and O_2 Addition on Chamber Stability during Silicon Nitride Layer Etching in UNITY II-IEM Plasma Source

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Effects of N_2 Addition on Aluminum Alloy Etching in Inductively Coupled Plasma Source
Effects of Gas Species on Charging Induced Tungsten Plug Corrosion during Post Metal Etch Process
Effects of Macroscopic Pattern Density and O_2 Addition on Chamber Stability during Silicon Nitride Layer Etching in UNITY II-IEM Plasma Source

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