2216 電子パッケージ接合部の機械的疲労損傷(J10-2 接合界面強度評価,J10 締結・接合部の力学とプロセス)

概要

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Recently, flip-chip technique was developed as the new process of electronic package. It is used for a lot of products from the reason for the consideration to the environment and electronic performance. Electronic package is usually applied thermal cyclic load from ON/OFF of power. It brings a fatigue to the packaging part. A heat cycle test is done to evaluate reliability of an electronic package. However, the test takes a lot of time and the cost. Doing some other acceleration test could be was helpful on it. In this study, in order to compare with thermal cycle test, mechanical fatigue test was carried out and delamination and damage behavior were observed. Crack initiation and propagation process were studied by in-situ observation fatigue test and FEM analysis.
一般社団法人日本機械学会の論文
2005-09-18