Direct Micro-joining of Copper Materials with YAG Laser Beams(Laser processing (continued))
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概要
- 論文の詳細を見る
Direct micro joining with YAG laser beams between copper wire and plate or substrate board was carried out. A contact angle between wire and plate affected peeling strength greatly. And an effect of pulse control was also great and it was good work for control of wire melt behavior. In cases of plate of 200μm and 100μm in thickness, high peeling strength of 4N with little dispersion was obtained in pulse control condition. However, in case of copper substrate board of 70μm in thickness, the strength was poor. Because of few thermal capacity, thermal conditions tended to be changed sensitively by conditions such as contact angle, surface state of wire, accuracy of wire setup and so on.
- 一般社団法人日本機械学会の論文
- 2005-10-18
著者
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Watanabe Takehiro
Department of Gene Diagnostics and Therapeutics, Research Institute, International Medical Center of
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TAKAHASHI Kenji
Graduate School of Biosphere Science, Hiroshima University
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Watanabe Takehiro
Department Of Electronics And Mechanical Engineering.
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MATSUSAKA Souta
Department of Electronics and Mechanical Engineering.
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WADA Tsutomu
Department of Electronics and Mechanical Engineering.
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Watanabe Takehiro
Department Of Electronics And Mechanical Engineering Chiba University
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Takahashi Kenji
Graduate School Of Engineering Chiba University
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Takahashi Kenji
Graduate School Of Biosphere Science Hiroshima University
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Wada Tsutomu
Department Of Clinical Pharmacology University Of Toyama
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