Formation of Anodic Film on Copper in 3% NaCl Aqueous Solution

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概要

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• Studies on electrochemical behaviors of copper in 3% NaCl aqueous solution have been carried out potentiodynamically in the range of -0.2 to +1.3 V at different rates of linearly increasing potential. Furthermore, the effects of the following factors on the electrochemical behaviors of copper have been examined : (1) removal of surface film by mechanical abrasion ; (2) maintenance of a constant composition of the solution in a test cell ; (3) suppression of convections of the corrosion products by using a shielded anode. The results are discussed with regard to the mechanism of anodization under a condition under which the surface film is retained or lost. Two passivation phenomena result from the formation of Cu_2O and CuCl. Since the pH value of the electrolyte in the vicinity of the electrode is low in the high potential region, a stable domain of Cu_2O reduces and thereby copper becomes easily dissoluble. The surface film on copper is weak in adhesion and falls off easily by soft abrasion.

• 東北大学の論文

著者

• Sugawara Hideo

  The Research Institute For Iron Steel And Other Metals

関連論文

• Dezincification of Brass
• Anodic Behavior of Copper Electrode in NaCl Aqueous Solution
• Formation of Anodic Film on Copper in 3% NaCl Aqueous Solution

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