Anodic Behavior of Copper Electrode in NaCl Aqueous Solution

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概要

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• The electrochemical behaviors of copper in NaCl aqueous solutions have been studied. Polarization curves are measured in the range of -0.2 to +1.3 V at constant rate of the linearly increasing or decreasing potential. The experimental results are discussed in comparison with the potential-pH diagrams. Reflection electron diffraction has been carried out to examine the surface films formed on the copper electrode. In lower potential region Cu_2O is mainly formed on copper and the first passivation occurs, whereas in intermediate potential region the second passivation occurs due to the formation of Cu_2O and CuCl. On the other hand, CuCl reacts on excess Cl^- ions to form the soluble complex CuCl_2^- in higher potential region. In general, the anodic dissolution of copper in an aqueous solution containing Cl^- ions is due to the reaction Cu→Cu^+. The observed electrode potential coincides with the potential-pH diagram as far as the surface film is thin. However, it is not the case in the thick surface film region.

• 東北大学の論文

著者

• Sugawara Hideo

  The Research Institute For Iron Steel And Other Metals

関連論文

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• Anodic Behavior of Copper Electrode in NaCl Aqueous Solution
• Formation of Anodic Film on Copper in 3% NaCl Aqueous Solution

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